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논문명(제목만) Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via 
논문명 Hyunwoong Kim, Seonghi Lee, Dongryul Park, Jungil Son, Yongho Lee, Sungwook Moon, Jiseong Kim and Seungyoung Ahn, "Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via", 2024 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), March 19, 2024. 
Year 2023 
국내/국외 International 
Author Hyunwoong Kim 
Co-aunthor Seonghi Lee, Dongryul Park, Jungil Son, Yongho Lee, Sungwook Moon, Jiseong Kim and Seungyoung Ahn 
Title Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via 
Conference Name 2024 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 
Acronym EDAPS 
Publish March 19, 2024 
순번 123 

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