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논문명(제목만) Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR) 
논문명 Hyunwoong Kim, Gagyeong Park, Seunghun Ryu, Jongwook Kim, Jaehoon Lee, and Seungyoung Ahn, "Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)", 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+ SIPI) 
Year 2023 
국내/국외 International 
Author Hyunwoong Kim 
Co-aunthor Gagyeong Park, Seunghun Ryu, Jongwook Kim, Jaehoon Lee, and Seungyoung Ahn 
Title Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR) 
Conference Name 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+ SIPI) 
Acronym EMC+ SIPI 
Publish 2023-07-29 
순번 114 

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