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논문명(제목만) Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5 D/3D Package for High-speed Serial Link 
논문명 Seonghi Lee, Hyunwoong Kim, Jiyoung Park, Youngho Lee, Sungwook Moon, and Seungyoung Ahn, "Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5 D/3D Package for High-speed Serial Link", 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+ SIPI) 
Year 2023 
국내/국외 International 
Author Seonghi Lee 
Co-aunthor Hyunwoong Kim, Jiyoung Park, Youngho Lee, Sungwook Moon, and Seungyoung Ahn 
Title Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5 D/3D Package for High-speed Serial Link 
Conference Name 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+ SIPI) 
Acronym EMC+ SIPI 
Publish 2023-07-29 
순번 115 

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