International Journal

Welcome to Electromagnetic Compatibility LAB

논문명(제목만) Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory 
논문명 Hyunwoong Kim, Jongchoel Park, Sanguk Lee, Jongwook Kim and Seungyoung Ahn, "Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory," in IEEE Transactions on Components, Packaging and Manufacturing Technology 
Year 2023 
국내/국외 International 
Author Hyunwoong Kim 
Co-aunthor Jongchoel Park, Sanguk Lee, Jongwook Kim and Seungyoung Ahn 
Title Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory 
Journal Name IEEE Transactions on Components, Packaging and Manufacturing Technology 
Acronym TCPMT 
Publish 2023 
Date 2023 
순번 119 

.