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논문명(제목만) Signal Integrity Analysis of Through-Silicon Via (TSV) with a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface 
논문명 Hyunwoong Kim, Seonghi Lee, Jongcheol Park, Yujun Shin, Seongho Woo, Jongwook Kim, Jaeyong Cho, and Seungyoung Ahn,
"Signal Integrity Analysis of Through-Silicon Via (TSV) with a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface",
IEEE Transactions on Components, Packaging and Manufacturing Technology 
Year 2023 
국내/국외 International 
Author Hyunwoong Kim 
Co-aunthor , Seonghi Lee, Jongcheol Park, Yujun Shin, Seongho Woo, Jongwook Kim, Jaeyong Cho, and Seungyoung Ahn, 
Title Signal Integrity Analysis of Through-Silicon Via (TSV) with a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface 
Journal Name IEEE Transactions on Components, Packaging and Manufacturing Technology 
Acronym TCPMT 
Publish 2023 
Date 2023 
순번 117 

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