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논문명(제목만) High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling 
논문명 Sukjin Kim, Daniel Hyunsuk Jung, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, Seungyoung Ahn, Jonghoon Kim, Joungho Kim, "High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling," IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 5, No. 7, pp. 863-878, Jul. 2015. 
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