1
Jun So Park, Joohee Kim, Jonghyun Cho, Kiyeong Kim, Taigon Song, Seungyoung Ahn, Junho Lee, Hyungdong Lee, Kunwoo Park, and Joungho Kim, "PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models," IEEE Transactions on CPMT, vol. 1 no. 2, pp. 208-219, Feb. 2011.