|
|
|
|
 |
|
 |
|
|
|
| |
 |
Jiseong Kim, Jonghoon Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, and Seungyoung Ahn, “Coil Design and Shielding Methods for Magnetic Resonant Wireless Power Transfer System, Proceedings of the IEEE, Issue 99, Sep. 2012. |
| |
|
Jaegue Shin, Seungyong Shin, Yangsu Kim, Seungyoung Ahn, Seokhwan Lee, Guho Jung, Boyune Song, Seongjeub Jeon, and Dong Ho Cho, “Design and Implementation of a Shaped Magnetic Resonance Based Wireless Power Transfer System for Roadway-Powered Moving Electric Vehicles,” IEEE Transactions on Industrial Electronics, Accepted, 2012. |
| |
 |
Seungyoung Ahn, Yangbae Chun, Dong-Ho Cho, and Joungho Kim, “Wireless Power Transfer Technology in On-Line Electric Vehicle,” Journal of Electromagnetic Engineering and Science, vol. 11, no. 3, pp. 174-182, Sep. 2011.
|
|
|
Jonghoon Kim, Hongseok Kim, In-Myoung Kim, Young-Il Kim, Seungyoung Ahn, Jiseong Kim, and Joungho Kim, “Reduction of Electromagnetic Field from Wireless Power Transfer Using a Series-Parallel Resonance Circuit Topology,” Journal of Electromagnetic Engineering and Science, vol. 11, no. 3, pp. 166-173, Sep. 2011.
|
|
|
Jeonghyeon Cho, Eakhwan Song, Heegon Kim, Seungyoung Ahn, Jun So Pak, Jiseong Kim, and Joungho Kim, “Mixed-mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-level Differential Interconnects,” IEEE Transactions on Electromagnetic Compatibility, vol.53, no.3, pp. 814-822, Aug. 2011.
|
|
|
Hyun Ho Park and Seungyoung Ahn, “Mitigation of noise coupling on RF cable using electromagnetic bandgap structures,” Electronics Letters, Accepted, 2011. |
|
|
Minchul Shin, Myunghoi Kim, Jiseong Kim, Joungho Kim, and Seungyoung Ahn, “A Small-size, Low-cost, and Wideband Continuous-time Linear Passive Equalizer using Embedded Cavity Structure on High-Speed Digital Channel,” Transactions on Electromagnetic Compatibility, Submitted, 2011. |
|
|
Minchul Shin, Jongjoo Shim, Hyungsoo Kim, Jiseong Kim, Myounghoi Kim, Woojin Lee, Seungyoung Ahn, Gunwoo Park and Joungho Kim, “An On-chip Signal Integrity Analyzer (OSIA) Circuit and Its Application for Monitoring of Package-level Eye Diagram in High-speed Digital I/O Channel,” Transactions on Advanced Packaging, Accepted, 2011. |
|
|
Myunghoi Kim, Kyoungchoul Koo, Yujeong Shim, Chulsoon Hwang, Jun So Pak, Seungyoung Ahn, and Joungho Kim, “Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multi-layer PCBs,” Transactions on Electromagnetic Compatibility, Accepted, 2011. |
|
|
Jun So Pak, Joohee Kim, Jonghyun Cho, Kiyeong Kim, Taigon Song, Seungyoung Ahn, Junho Lee, Hyungdong Lee, Kunwoo Park, and Joungho Kim, “PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models,” IEEE Transactions on CPMT, vol. 1 no. 2, pp. 208-219, February 2011. |
|
|
Junho Lee, Seungyoung Ahn, Woon-Seong Kwon, Kyung-Wook Paik, and Joungho Kim, “Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameter Measurement,” Transactions on IEICE, Vol. E87-C, No. 9, September 2004. |
|
|
Seungyoung Ahn, Junho Lee, Junwoo Lee, Jonghoon Kim, Woonghwan Ryu, Young-Soo Kim, Byung-Hun Kum, Hyun-Seok Choi, Chong K. Yoon, and Joungho Kim, “Over GHz Electrical Circuit Model of a High-Density Multiple Line Grid Array (MLGA) Package”, IEEE Transactions On Advanced Packaging, Volume 26, Issue 1, February 2003, pp. 90-98. |
|
|
Woonghwan Ryu, Myung-Jin Yim, Seungyoung Ahn, Junho Lee, Woopoung Kim, Kyung-Wook Paik, and Joungho Kim, "High-Frequency SPICE Model of Anisotropic Conductive Film Flip-Chip Interconnections Based on a Genetic Algorithm," IEEE Transaction on Components and Packaging Technologies, Vol. 23, Issue.3, pp. 542-545, September 2000. |
|
|
Woonghwan Ryu, Junwoo Lee, Hyungsoo Kim, Seungyoung Ahn, Namhoon Kim, Baekkyu Choi, Donggun Kam, and Joungho Kim, “RF Interconnect for Multi-Gbit/sec Board-Level Clocck Distribution,” IEEE Transactions on Advanced Packaging, Vol. 23, Issue. 3, pp. 398-407, August 2000. |
|
|
Myung Jin Yim, Woonghwan Ryu, Young-Doo Jeon, Junho Lee, Seungyoung Ahn, Joungho Kim, and Kyung-Wook Paik, "Microwave Model of ACF Flip-Chip Interconnections for High-Frequency Application,” IEEE Transactions on CPT, Vol. 22, Issue 4, pp.575-581, Dec. 1999. |
|
|
|
|
| |
|
|
|
|
