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논문명(제목만) Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory 
논문명 Hyunwoong Kim, Jongchoel Park, Sanguk Lee, Jongwook Kim, and Seungyoung Ahn, "Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory," IEEE Transactions on Components, Packaging and Manufacturing Technology , Vol. 13, No. 12, pp. 1973-1988, November 20, 2023. 
Year 2023 
국내/국외 International 
Author Hyunwoong Kim 
Co-aunthor Jongchoel Park, Sanguk Lee, Jongwook Kim and Seungyoung Ahn 
Title Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory 
Journal Name IEEE Transactions on Components, Packaging and Manufacturing Technology 
Acronym TCPMT 
Val 13 
No 12 
Page 1973-1988 
Publish 2023 
Date 2023 
순번 119 

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