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2020-02-14 16:10:00
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논문명(제목만) Rigorous Mathematical Model of Through-Silicon Via (TSV) Capacitance 
논문명 Kibeom Kim, Jedok Kim, Hongkyun Kim, and Seungyoung Ahn, “Rigorous Mathematical Model of Through-Silicon Via (TSV) Capacitance,” IET Circuits, Devices & Systems, Article in IET Circuits Devices & Systems, https://doi.org/10.1049/iet-cds.2017.0157 Mar. 2018. 
순번 60 

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