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논문명(제목만) Optimization of the Power/Ground Ball Map in 3D-IC BGA Packages with Multiple Power Domains using Deep Reinforcement Learning 
논문명 Seunghun Ryu, Dongryul Park, Hyunwoong Kim, Seonghi Lee, Sanguk Lee, Hyunwoo Kim, Seongho Woo, Seokbeom Yong, Sangsub Song, and Seungyoung Ahn, "Optimization of the Power/Ground Ball Map in 3D-IC BGA Packages with Multiple Power Domains using Deep Reinforcement Learning," IEEE Transactions on Components, Packaging and Manufacturing Technology, October 29, 2024. 
Year 2024 
국내/국외 International 
Author Seunghun Ryu 
Co-aunthor , Dongryul Park, Hyunwoong Kim, Seonghi Lee, Sanguk Lee, Hyunwoo Kim, Seongho Woo, Seokbeom Yong, Sangsub Song, and Seungyoung Ahn 
Title Optimization of the Power/Ground Ball Map in 3D-IC BGA Packages with Multiple Power Domains using Deep Reinforcement Learning 
Journal Name IEEE Transactions on Components, Packaging and Manufacturing Technology 
Acronym TCPMT 
Date 2024.10.29 
순번 132 

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