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논문명(제목만) High-Frequency SPICE Model of Anisotropic Conductive Film Flip-Chip Interconnections Based on a Genetic Algorithm 
논문명 Woonghwan Ryu, Myung-Jin Yim, Seungyoung Ahn, Junho Lee, Woopoung Kim, Kyung-Wook Paik, and Joungho Kim, "High-Frequency SPICE Model of Anisotropic Conductive Film Flip-Chip Interconnections Based on a Genetic Algorithm," IEEE Transaction on Components and Packaging Technologies, Vol. 23, Issue.3, pp. 542-545, Sep. 2000. 
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